| 摘要 |
PURPOSE:To prevent the deformation of a bonding wire loop generated in a cooling process after heating bonding in a wire bonding device. CONSTITUTION:One constitition is that remaining heat by a radiation and a convection from a heat block 4 is received without moving a lead frame 3 only for a predetermined time even after the heat block 4 is lowered after the completion of bonding for bringing cooling after heating bonding to slower cooling than natural cooling. The other constitition is that a pipe 11 for cooling is mounted near an end in the carrying direction of the lead frame 3 of the heat block 4 for bringing cooling after heating bonding to forced air cooling. |
