| 摘要 |
PURPOSE:To enable the leads of an electronic component disposed narrower in pitch to be well soldered without causing a short circuit or a connection failure to the leads. CONSTITUTION:A first process wherein solder is fed to the electrodes 21 of a printed circuit board 20, a second process wherein the leads of an electronic component are made to confront the electrodes 21 of the circuit board 20, and a third process wherein the leads of the electronic component are brought into contact with the electrodes 21 of the circuit board 20 and solder is fused by heating are provided in an electronic component lead connecting method. The first process is composed of a first step wherein the tips 40a of a solder fine wire 40 is fixed to the electrode 21 by pressure with a wedge 60, a second step wherein the solder fine wire 40 is fixed again to the electrode 21 by pressure with the wedge 60 after the wedge 60 is moved as the solder fine wire 40 is fed, and a third step wherein the solder fine wire 40 is cut off as it is lifted up and clamped by clampers 50. |
