| 摘要 |
<p>PURPOSE:To suck and hold a wafer with high accuracy (high flatness) by providing the constitution, wherein uneven vacuum suction force does not act on the wafer caused by the direction of the orientation flat of the wafer, in the same vacuum suction device for water. CONSTITUTION:A vacuum suction device for wafer is constituted of an outer surface rim 1 of a wafer, an inner rim 2 of the wafer, which keeps the inner airtight property, an orientation flat rim 3, which has the equivalent shape as the shape of the orientation flat part of the wafer and which are provided at orthogonally intersecting two places, a cylindrical projection 5 and independent vacuum path and vacuum metal fitting 8 for sucking the wafer 6 in the vacuum state on a substrate, whose parent material is ceramics. The device is also constituted of an orientation flat vacuum chamber 9 surrounded with the outer surface rim 1 of the wafer and the orientation flat rim 3, an outer vacuum chamber 10 and an inner vacuum chamber 11, which is surrounded with the inner rim 2 of the wafer.</p> |
