发明名称 MULTILAYER LEAD FRAME
摘要 <p>PURPOSE:To make it possible to enhance dramatically electric properties for a high speed signal. CONSTITUTION:In terms of a multilayer lead frame where at least one plane separately formed is joined with a lead frame body by way of an electric insulation layer 20, the insulation layer 20 connects a thin film-like dielectric layer comprising an oxide tantalum joined on the plane 18 by way of a conducing layer 14 to each of the tips of lead wires formed on the dielectric layer 16 and the lead frame body. Furthermore, the lead frame consists of an anisotropic conducting film 12 which is electrically insulating, but those conductive areas 22 subjected to the application of a thrusting force by the tip 10 of the lead wire are excluded.</p>
申请公布号 JPH06326212(A) 申请公布日期 1994.11.25
申请号 JP19930110330 申请日期 1993.05.12
申请人 SHINKO ELECTRIC IND CO LTD 发明人 FUKASE KATSUYA;KOYAMA TETSUYA
分类号 H01L23/12;H01L23/50;(IPC1-7):H01L23/12 主分类号 H01L23/12
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