| 摘要 |
PURPOSE:To manufacture a multilayered copper clad laminated board wherein a release film is arranged on the outermost layer and molded, resin does not flow out from a through hole, defective etching is not generated in the process for forming a circuit pattern on the outermost layer, and a blind viahole is formed. CONSTITUTION:An outer layer board 1 wherein holes 3, through hole plating, and a single side circuit 2 are formed beforehand is laminated on an inner layer board 4 via prepreg 5, in the manner in which the circuit 2 forming surface of the outer layer board is made to face the inner layer board 4 side. Further a release film 6 is arranged on the outermost layer, and molded in a unified body by heating and pressing. After that, the release film 6 is removed. |
