| 摘要 |
PURPOSE:To provide the manufacturing method, of a semiconductor device, wherein the close contact property of a semiconductor chip with a sealing member can be enhanced when the semiconductor device is sealed with the sealing member, to provide the sealing member used for the manufacturing method and to provide the manufacturing method. CONSTITUTION:Sheets 18a, 18b, for resin sealing, which are provided with protruding parts are prepared, and a semiconductor chip 10 is prepared. Protruding parts 17a, 17b at the sheets 18a, 18b are brought into contact with at least active-element faces of the chip 10, the sheets 18a, 18b are pressurized, and the chip 10 is sealed. By this constitution, top parts of the protruding parts 17a, 17b are first brought into contact with surfaces of the chip 10. When the sheets are pressurized further, contact faces of the protruding parts 17a, 17b with the chip 10 are spread toward the outside, the air is pushed out toward the outside, and the air hardly remains on the surfaces of the chip 16. As a result, the close contact property of the chip 10 with the sheets 18a, 18b is enhanced.
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