HOLLOW TYPE ELECTRONIC DEVICE SEALING SHEET, AND MANUFACTURING METHOD OF HOLLOW TYPE ELECTRONIC DEVICE PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a hollow type electronic device sealing sheet capable of suppressing variations in an amount of resin inserted to a hollow part between an electronic device and an adherend in each package.SOLUTION: In a hollow type electronic device sealing sheet, an entry amount X1 measured by processes of following each step is equal to 0 μm or more and 50 μm or less, and a value obtained by subtracting the entry amount X1 from an entry amount Y1 is equal to 50 μm or less. A manufacturing method comprises the steps of: measuring the entry amount X1 of resin constructing a sample for a hollow part between a dummy tip and a glass substrate after a step for embedding the dummy tip into the sample of the hollow type electronic device sealing sheet: obtaining a sealing body sample by thermal-hardening the sample; and measuring the entry amount Y1 of resin into the hollow part in the sealing body sample.SELECTED DRAWING: Figure 1