CONDUCTOR PASTE COMPOSITION

摘要

PURPOSE:To solve such a problem that conductor paste composition used for connecting wiring layers with each other in a ceramic multilayer wiring board is incompletely filled into a viahole in a viahole filling process due to that the center of conductor paste composition filled in a viahole is recessed due to a leveling action. CONSTITUTION:Conductor paste composition 1 is filled into a viahole 2 provided to a ceramic wiring board 4, wherein the composition 1 is composed of 75.0 to 90.5% by weight of inorganic component formed of conductor material powder and glass powder, 9.0 to 20.0% by weight of organic vehicle formed of organic binder and solvent, and 0.5 to 5.0% by weight of metal organic compound solution.