| 摘要 |
<p>PURPOSE:To provide the method for controlling dicing processing and a processing quality-control system, which can measure the processing state of cutting based on dispersion and can grasp the processing quality of a semiconductor wafer. CONSTITUTION:In the method (or controlling dicing processing (B), photographing for cut-line check is performed for almost entire length of each of a plurality of cut lines selected on a semiconductor wafer in place of the conventional measurement (A) at a plurality of limited points, and the image signal of the cut line is obtained. A mask is applied on a part CR, where the cut line intersects the other cut line, and the data indicating the processing state are detected. The dicing processing quality and the dicing processing means are controlled based on the detected data. This is the characteristic of the this method. Furthermore, a plurality of the dicing means and the measuring means, which perform the continuous cut-line check, are combined, and the throughput of the processing is improved.</p> |
