| 摘要 |
PURPOSE:To improve resist formation and to enhance developability and adhesion by incorporating a film-forming vinyl type copolymer specified in molecular weight and an ethylenically unsaturated compound, and plural specified compounds. CONSTITUTION:This resin composition contains the film-forming vinyl type copolymer soluble in a dilute aqueous solution of alkali and having a weight average molecular weight of 10,000-150,000, the ethylenically unsaturated compound, the compound represented by formula I and the compound represented by formula II, and in formulae I and II, each of R1-R3 is H or Cl or 1-5 C alkyl or the like, and all of them are not H at the same time; each of R4 and R5 is 1-3C alkyl; R6 is -OR7, -OCH2CH2OR7, H 1-13C alkyl, phenyl, or the like; and R7 is 1-13C alkyl. The ethylenically unsaturated compound is, preferably, such as (meth)acrylate monomers embodied by trimethylolpropane (meth)-acrylate and the like. |
