Method of machining material by diode radiation

摘要

The invention relates to a method of machining material with diode radiation, in particular laser-diode radiation. In order to adapt the beam profile to the machining process, the method is carried out in such a way that the radiation emitted by a multiplicity of diodes is directed with a predetermined beam profile onto the machining area of the workpiece and that a change in the distribution of the intensity in the beam profile is effected by control of the diode power output.