发明名称 |
PALLADIUM LAYERS DEPOSITION PROCESS |
摘要 |
Palladium layers are often used as protective layers on the surface of substrates made of copper, nickel and cobalt, as well as their alloys with each other and/or with phosphorous or boron. The known processes, however, allow no adhesive, permanently glossy, bright palladium layers with few pores to be deposited. Such palladium layers may however be deposited from a formaldehyde-free chemical bath which contains a palladium salt, one or several nitrogenated complexing agents and formic acid or formic acid derivatives at a pH value higher than 4. Pretreating in a cementation palladium bath is also possible. |
申请公布号 |
WO9426954(A1) |
申请公布日期 |
1994.11.24 |
申请号 |
WO1994DE00572 |
申请日期 |
1994.05.13 |
申请人 |
ATOTECH DEUTSCHLAND GMBH;STEIN, LUDWIG;MAHLKOW, HARTMUT;STRACHE, WALTRAUD |
发明人 |
STEIN, LUDWIG;MAHLKOW, HARTMUT;STRACHE, WALTRAUD |
分类号 |
C23C18/30;C23C18/34;C23C18/42;C23C18/44;H05K3/24;(IPC1-7):C23C18/44 |
主分类号 |
C23C18/30 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|