发明名称 PALLADIUM LAYERS DEPOSITION PROCESS
摘要 Palladium layers are often used as protective layers on the surface of substrates made of copper, nickel and cobalt, as well as their alloys with each other and/or with phosphorous or boron. The known processes, however, allow no adhesive, permanently glossy, bright palladium layers with few pores to be deposited. Such palladium layers may however be deposited from a formaldehyde-free chemical bath which contains a palladium salt, one or several nitrogenated complexing agents and formic acid or formic acid derivatives at a pH value higher than 4. Pretreating in a cementation palladium bath is also possible.
申请公布号 WO9426954(A1) 申请公布日期 1994.11.24
申请号 WO1994DE00572 申请日期 1994.05.13
申请人 ATOTECH DEUTSCHLAND GMBH;STEIN, LUDWIG;MAHLKOW, HARTMUT;STRACHE, WALTRAUD 发明人 STEIN, LUDWIG;MAHLKOW, HARTMUT;STRACHE, WALTRAUD
分类号 C23C18/30;C23C18/34;C23C18/42;C23C18/44;H05K3/24;(IPC1-7):C23C18/44 主分类号 C23C18/30
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