发明名称 |
CARBON COMPOSITIONS AND PROCESSES FOR PREPARING A NON-CONDUCTIVE SUBSTRATE FOR ELECTROPLATING |
摘要 |
The present invention is directed to an improved composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0.1 to 20 % by weight carbon (e.g. graphite or carbon black) having a mean particle size within the range of 0.05 to 50 microns; optionally, 0.01 to 10 % by weight of a water soluble or dispersible binding agent for binding to the carbon particles; optionally, an effective amount of a anionic dispersing agent for dispersing the bound carbon particles; optionally, an amount of a surfactant that is effective for wetting the through hole; a pH within the range of 4-14; and an aqueous dispersing medium. Improved methods of applying the composition to a through hole, a printed wiring board having a through hole treated with the composition, and a method of fixing a carbon coating deposited on a through hole using an acid solution are also disclosed. |
申请公布号 |
WO9426958(A1) |
申请公布日期 |
1994.11.24 |
申请号 |
WO1994US05267 |
申请日期 |
1994.05.12 |
申请人 |
ELECTROCHEMICALS, INC. |
发明人 |
THORN, CHARLES, EDWIN;POLAKOVIC, FRANK;MOSOLF, CHARLES, A. |
分类号 |
B01F17/00;C08K3/04;C08L101/00;C09D201/00;C25D5/54;C25D7/00;H05K3/42;(IPC1-7):C25D5/54 |
主分类号 |
B01F17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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