| 摘要 |
An electronic circuit package comprises a carrier (11), a microchip (12), which has bond pads (13) and is attached to the carrier, and a flexible circuit comprising a first flexible circuit element cable (15) attached to the region of the carrier adjacent the microchip and a second flexible circuit element cable (17) attached to and stepped back from the first cable. Each element includes an electrically conductive circuit pattern defined thereon with selected ones of the microchip bond pads (13) being electrically connected by wirebonds (16) to a circuit pattern on the first element of the flexible circuit and further selected ones of the bond pads being electrically connected by wirebonds to the circuit pattern of the second element. <IMAGE> |
