UV-curable adhesive semiconductor chip mounting process

摘要

PCT No. PCT/DE90/00290 Sec. 371 Date Feb. 21, 1992 Sec. 102(e) Date Feb. 21, 1992 PCT Filed Apr. 17, 1990 PCT Pub. No. WO91/01043 PCT Pub. Date Jan. 24, 1991.Assembly of semiconductor chips is accomplished using an acrylate-based adhesive which can be cured rapidly by UV light and which gives an adhesive bond that is resistant to soldering by can be readily removed by solvents after soldering. During assembly, the back sides of the semiconductor chips are bonded to a temporary carrier by the adhesive and adjusted to the proper mirror image position on the carrier before the adhesive is cured. The chip array is then soldered on a component and the temporary carrier is removed from the chips by a solvent.