发明名称 |
Electrical module assembly |
摘要 |
An electrical module assembly (100) includes a mounting frame (130) having a passage (135) extending though the mounting frame (130). A heat sink (160) is positioned within the passage (135) of the mounting frame (130). A module substrate (120) is located on or near the heat sink (160) such that there is thermal conductivity between the module substrate (120) and the heat sink (160). A heat-generating semiconductor device (122), such as a power amplifier (122), which requires heat dissipation, is positioned on the module substrate (120) such that there is thermal conductivity between the heat-generating semiconductor device and the heat sink (160). Electrical connection to the module substrate (120) is provided through the mounting frame (130).
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申请公布号 |
US5367434(A) |
申请公布日期 |
1994.11.22 |
申请号 |
US19930057376 |
申请日期 |
1993.05.06 |
申请人 |
MOTOROLA, INC. |
发明人 |
GRIFFIN, CURTIS M.;LAUDER, JAMES V.;OOI, LENG H. |
分类号 |
H01L23/36;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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