发明名称 ASSEMBLY PACKAGING DEVICE
摘要 PURPOSE:To provide a device having improved handling characteristics and workability and high reliability in an assembly packaging wherein a plurality of trays each carrying small electronic components are stacked in layers and bundled collectively. CONSTITUTION:There are provided a tray comprising a main body 1 having a concave section wherein the peripheral portion has a larger thickness than the central portion, a storage section provided in the body 1, recesses 4a-4d for connecting grip sections 3a-3d formed by cutting off a portion of the periphery, and connecting protrusions 5a-5d formed on the periphery, and a pallet having built-in connecting holes into which protrusions at the end of the connecting protrusions of the tray are fitted, and the tray wherein electronic components are stored in the storage section 2 is connected to the pallet and then the trays are combined together and stacked on one another so that they are bundled collectively, whereby an assembly packaging device having high workability and reliability can be obtained.
申请公布号 JPH06321275(A) 申请公布日期 1994.11.22
申请号 JP19930106599 申请日期 1993.05.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TANAKA ZENNOSUKE;TSUJI TOSHIMITSU;OKUZAWA KAZURO
分类号 B65D21/02;B65D85/00;B65D85/38;B65D85/86 主分类号 B65D21/02
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