| 摘要 |
<p>PURPOSE:To automate the separation of wafers from a laminated body made by stacking multiple wafers in close contact condition. CONSTITUTION:When a wafer 1 of the uppermost layer is separated from a laminated body 2 made by closely stacking multiple sheet wafers 1, and cut one by one in sequence, two attracting pads 3a and 3b are positioned on the upper surface of the laminated body 2 of the wafer 1 movably in vertical direction, and two peripheral parts of the wafer 1 of the uppermost layer are attracted vacuously. Then one attracting pad 3a is raised slightly and tilted to deflect the peripheral part of the wafer 1 held by the attracting pad 3a and form a clearance (m) between the wafers, and air enters through the clearance (m) to release the close contact condition of the wafers. After that, both attracting pads 3a and 3b are raised to separate the wafer 1 of the uppermost layer only and cut securely one by one.</p> |
