| 摘要 |
The invention relates to a method of making electronic modules for electronic memory cards and to electronic modules thus obtained. Starting with a metal strip, in which patterns have been cut out and to which semiconductor chips have been attached, this assembly is placed in the cavity of a transfer mold. The cavity has two portions located on the two sides of the strip in order to ensure a good mechanical bond between the conductive parts of the pattern before it is cut from the remainder of the strip.
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