| 摘要 |
The subject of the present invention is the interconnection of stacked housings, each of the housings, for example, encapsulating a semiconductor chip containing an integrated circuit, a memory for example. To this end, housings (2) equipped with connecting pins (21) and mounted on a support grid (4) preferably forming a thermal sink, are stacked and secured to one another with the aid of a resin coating (5), for example. The stacking is cut up in such a way that the pins of the housings and the grid come flush with the faces (31, 32) of the stacking (3). The connection of the housings together and of the latter to connecting terminals of the stack is carried out on the faces of the stack. The connecting terminals are, as appropriate, equipped with connecting pins. <IMAGE> |
