Verfahren zum Abscheiden eines Metalls auf einem Substrat aus einem Galvanisierbad

摘要

The invention is directed towards a photoresist composition comprising: (a) a monomeric component containing at least one ethylenically unsaturated group, (b) a polymeric binder, and (c) a photoinitiator system which contains at least: (i) a first component which is benzophenone, bis-4,4'-dimethylaminobenzophenone, bis-4,4'-(diethylamino)benzophenone, 2-isopropylthioxanthone, 2-chlorothioxanthone, 1-chloro-4-propxythioxanthone, 10-butyl-2-chloro-9(10H)-acridinone, 2-chloro-N-methylacridone, 2-chloro-N-ethylacridone, 2-chloro-N-isopropylacridone, 2,4-diethylthioxanthone, 8-phenyl-acridine, 4-methyl-4-trichloromethyl-2,5-cyclohexadien-1-one, or a substituted 2,4,5,2',4',5-hexaaryl-biimidazole; and (ii) a second component which is a C6-C12 alkyl or aryl ester of p-dialkylaminobenzoic acid or a C7-C20 aralkyl or cycloalkyl ester of p-dialkylaminobenzoic acid, wherein the alkyl groups of said p-dialkylaminobenzoic acid are independently C1-C4 alkyl. The photoresist composition of the invention is useful in a process for plating a metal, especially copper, onto a substrate from a plating bath in printed circuit board manufacture. Reduced contamination of the bath is effected and a higher quality of plating metal having fewer defects is achieved by coating on the substrate. c