| 摘要 |
Such methods are usually employed in a substrate-surface inspection machine for the inspection of wafers. In addition to very small particles (in the range of 100 nm) crystal defects, metallic impurities, polishing defects, scratches and other irregularities on wafers can be visualised using devices of this type. In this case, such wafers are inserted, in so-called wafer cassettes (1, 2), before or after inspection into an inspection device and are presented to a gripping system on accurate positioning blocks (3, 4), and are from there loaded using a robotically working swivelling arm (5) onto an inspection platform (7) and measured, the result being evaluated and visualised using complex electronics (8). <IMAGE> |
