| 摘要 |
<p>This invention relates to a method of separating at least one piece from a super hard material plate having top and bottom surfaces, comprising providing a laser capable of cutting said super hard material plate; making a cut with said laser through the top surface of said plate, said cut defining the shape of the piece to be separated and being to a depth which is less than the overall thickness of said plate; and separating said piece from said plate by applying an effective amount of pressure to said plate along the line of said cut to separate the uncut portion of said plate adjacent said cut. <IMAGE></p> |
