| 摘要 |
<p>An improved gold paste for use in the manufacture of ceramic circuit boards is disclosed, which has a composition comprising an inorganic component, an organic binder, a solvent. The inorganic component contains (a) 84-94 wt% powdery gold with a particle size of 0.3-0.7 mu m, (b) 0.3-2.0 wt% powdery V2O5 with a particle size of 0.3-2.0 mu m, and (c) 0.3-2.0 wt% powdery CuO with a particle size of 0.3-2.0 mu m. <IMAGE></p> |
