发明名称 Arrangement comprising laser diodes and a cooling system, and method for its production
摘要 The subject-matter of the invention is arrangements comprising semiconductor laser diodes and a cooling system, and a method for their production. In particular, the invention relates to a component or an arrangement comprising one or more laser diodes, designed as horizontal or vertical emitters, and a thermally coupled cooling system in layer design, the cooling system including microchannels, feed channels and discharge channels as well as, if appropriate, distribution and collection channels, through which a coolant circulates. The method according to the invention for producing the cooling system is based on the concept of producing the channels by means of laser processing, punching or electrolytic technique (electroplating). In particualar, laser processing and electrolytic technique allow both three-dimensional or two-dimensional preparation or making of the individual cooling-channel layers. The invention allows simple production of microchannel heat sinks comprising 2, 3 and more layers, with virtually arbitrarily configured microchannels, in a multiplicity of materials such as, for example, copper and diamond. A preferred embodiment of the invention consists in that the cooling sytem has one or more large-area regions with microchannels, on each of which a multiplicity of laser diodes, or submounts with thermally coupled laser diodes, are arranged. The component may also consist of a plurality of modules with cooling channels and laser diodes which are arranged vertically stacked or adjacent to each other.
申请公布号 DE4315580(A1) 申请公布日期 1994.11.17
申请号 DE19934315580 申请日期 1993.05.11
申请人 FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V., 80636 MUENCHEN, DE 发明人 TREUSCH, HANS-GEORG, DR., 5100 AACHEN, DE;KRAUSE, VOLKER, DIPL.-ING., 5330 KOENIGSWINTER, DE;BUECHLER, ALEXANDER, 5100 AACHEN, DE
分类号 B23K26/382;H01L23/473;H01S5/024;H01S5/40;(IPC1-7):H01S3/043;H05K7/20;H01S3/025;B23K26/00 主分类号 B23K26/382
代理机构 代理人
主权项
地址