| 摘要 |
A process and apparatus for forming a reclosable closure profile, wherein the configuration of the closure profile is mechanically altered for controlling the width of the gap in a groove member by passing the closure profile, while still hot enough to be formed, through a profile gapping means, whereby the surfaces of the closure profile contact the gapping means, thereby maintaining the desired final gap width of the closure profile and/or whereby the gapping means includes a cutting means for notching the base of the groove member for controlling the closure force of the groove member.
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