发明名称 TIE-BAR CUTTING MOLD FOR IC LEAD FRAME
摘要 PURPOSE:To prevent a cutting edge from being broken and damaged and to reduce the cost of a maintenance operation in a metal mold which stamps out a tie bar part in a lead frame for a semiconductor IC. CONSTITUTION:Dies 1 as thin sheetlike cutting edges are inserted into gaps formed when two holder blocks 2, 3 which are provided respectively with a plurality of comb-tooth shaped grooves on four sides are combined, and a die unit is constituted. On the other hand, a punch unit is constituted in the same manner. The units are mounted in a position in which the lower mold and the upper mold of a die set are operated on the same track.
申请公布号 JPH06318660(A) 申请公布日期 1994.11.15
申请号 JP19930001471 申请日期 1993.01.08
申请人 NEC CORP;KEIKEN SEIKO KK 发明人 WAKAYAMA YASUO;HAMADA KAZUO
分类号 B21D28/00;B26F1/44;H01L23/50;(IPC1-7):H01L23/50 主分类号 B21D28/00
代理机构 代理人
主权项
地址