| 摘要 |
PURPOSE:To provide a multilayered circuit substrate in high bonding strength between a part mounting conductor circuit and an insulating layer capable of high density mounting as well as miniaturizing the circuit. CONSTITUTION:Within this manufacturing method, after the formation of the first conductor circuit 6a in a specific pattern on the surface of a flat plate type conductive base material, a surface roughened layer 7 is formed by roughening the surface of the first conductor circuit 6a and then said circuit is filled up simultaneously to form an insulating layer 8 having via holes on specific positions. Next, after roughening the surface of the insulating layer 8, a laminated body L in specific layer numbers is formed by repeating the forming step of conductor circuit 6b in specific pattern successively after pressure fixing or thermal pressure fixing an insulating base material, the laminated body L is released from the surface of the conductive base material 1 so as to transfer the laminated body L to the insulating base material 1. |
