| 摘要 |
A bonded wire inspection apparatus for inspecting wires bonded between the pads of a semiconductor chip and the leads of a lead frame being made up by an objective lens group that takes in an image of an object of inspection (such as a bonding wire, ball at the end of the wire, etc.), imaging lens groups that image the image taken in by the objective lens group, and cameras that photograph the images taken by the imaging lens groups, and these being all installed in an opto-head. The objective lens group is moved in a vertical direction by a Z-direction drive motor. Thus, the over all size of the inspection apparatus can be compact, dirt, etc. that has a deleterious effect on the object of inspection can be avoided, and the inspection precision can be significantly high.
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