发明名称 Process for non-selectively forming deposition film on a non-electron-donative surface
摘要 A process for forming a deposition film comprising aluminum comprises the steps of: treating chemically a surface of a substrate having an electron-donative surface and a non-electron-donative surface so as to terminate the electron-donative surface with hydrogen atoms, and thereafter placing the substrate in a space for deposition film formation; introducing gas comprising alkylaluminum hydride and hydrogen gas into the space for deposition film formation; and forming an aluminum film selectively on the electron-donative surface by maintaining the substrate at a temperature in the range of from not lower than the decomposition temperature of the alkylaluminum hydride to not higher than 450 DEG C.
申请公布号 US5364664(A) 申请公布日期 1994.11.15
申请号 US19920996875 申请日期 1992.12.22
申请人 CANON KABUSHIKI KAISHA 发明人 TSUBOUCHI, KAZUO;MASU, KAZUYA
分类号 C23C16/02;C23C16/20;C30B25/04;H01L21/205;H01L21/28;H01L21/285;H01L21/306;H01L21/3205;H01L21/768;(IPC1-7):B05D3/06;B05D3/00;C23C16/00 主分类号 C23C16/02
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