| 摘要 |
PURPOSE:To provide a multi lead type semiconductor device which prevents position deviation caused by fluidity of sealing resin between leads and a thin land part on which a semiconductor pellet is fixed. CONSTITUTION:In this semiconductor device, a semiconductor pellet 7 is fixed on a square land part 14, and the main part containing the land part 14 and idle end portions of leads 3 adjacently arranged on the periphery of the land part 14 is included in a metal mold cavity 9 and covered with resin. On the peripheral end surface of the land part 14 facing a resin injection part 10 of the cavity 9, a plurality of tongue segments T are arranged with a specfic spacing. The end portion of the tongue segment is bent in the direction to enlarge the interval from the idle end portion of the lead 3, and expands to the resin injection part 10. |
