Composition of polyepoxide and phosphorous-containing polyepoxide

摘要

The invention provides epoxide resin molding compositions for protectively covering semiconductor components, which are accessible in a cost-effective manner and have good processibility. The epoxide resin molding compositions provide virtually inflammable molded materials with a high glass transition temperature and a low thermal expansion coefficient without the addition of flameproofing agents, when they contain the following constituents: (A) an aromatic and/or heterocyclic polyepoxide resin which is free of phosphorous, optionally in combination with an aliphatic epoxide resin; (B) an epoxide-group-containing phosphorous compound; (c) an aromatic polyamine as a curing agent; and (D) filler material.