发明名称 |
Moulding composition comprising a thermoset component and thermoplast component |
摘要 |
A curable moulding composition in the form of a flowable particulate solid substantially non self-adhesive at temperatures up to 60 DEG C., flowable under shear and self-adhesive at temperatures in the range 60 DEG -150 DEG C. and hardenable at temperature over 150 DEG C., said composition comprising an uncured or partly cured thermoset resin precursor and, mixed intimately therewith, a polyarylsulphone containing the repeating units (Ph SO2 Ph)n and Ph1a linked through ether and/or thioether, where Ph is paraphenylene, Ph1 is phenylene, n is 1 to 2 a is 1 to 3 and groups Ph1 are (when a exceeds 1) linked through a single chemical bond or a divalent group other than SO2 or alkylene or are fused together. Preferably the polyarylsulphone contains end-groups of formula -D-Y where D is a divalent aromatic hydrocarbon group and Y is a group reactive with the thermoset precursor and has been incipiently reacted with the thermoset precursor.
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申请公布号 |
US5364914(A) |
申请公布日期 |
1994.11.15 |
申请号 |
US19910747436 |
申请日期 |
1991.08.13 |
申请人 |
IMPERIAL CHEMICAL INDUSTRIES PLC |
发明人 |
CHOATE, MARTIN T.;MCGRAIL, PATRICK;SEFTON, MARK S.;CARTER, JEFFREY T. |
分类号 |
C08L61/06;C08L61/10;C08L63/00;C08L81/06;F02F7/00;(IPC1-7):C08L61/10;C08L63/02;C08L63/04 |
主分类号 |
C08L61/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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