| 摘要 |
PURPOSE:To provide a multilayered printed-wiring board and manufacturing method thereof capable of easily manufacturing the metallic base multilayered printed-wiring board at low cost. CONSTITUTION:Within this manufacturing method, an outer layer 9 is formed by laminating a Cu plated insulating sheet whereon an insulating layer 2 is formed on a Cu foil surface on one or both surfaces of a metallic base Cu plated laminated board on whose one or both surfaces circuits are formed and then an exposed part 12 exposing a Cu foil land 13 or a circuit on said laminated board or the insulating layer 2 is provided by etching away the Cu foil in the required part on the outer layer 9 and simultaneously melting away the insulating layer 4 on that part, furthermore, circuits 5 are formed on the outer layer 9. At this time, the exposed part 12 is packaged with a semiconductor chip 6 close to the surface of metallic substrate 1 to be connected by a wire-bonding 7. Finally, as for the Cu plated insulating sheet, the insulating layer 4 comprising an insulating resin soluble in alkaline water solution formed on the Cu foil surface is to be used. |
