发明名称 METHOD FOR CONNECTING TCP LEAD WIRE TERMINAL AND CIRCUIT SUBSTRATE
摘要 PURPOSE:To increase the freedom of layout for a TCP element and to improve reliability in an electrical connection part by connecting the other edge of the lead wire of the TCP element and a circuit substrate with a pin lead which can be subjected to plastic machining and deformation easily. CONSTITUTION:The other edge of a lead wire 5 where one edge is connected to the input side of a TCT system element 4 and a circuit substrate 7 are connected by a pin lead 8 which can be subjected to plastic machining easily, is highly flexible, and is made of metal and then can be deformed in the longitudinal direction easily by providing a curved part 9 halfway, thus preventing stress due to bending operation from being applied to the lead wire part 5 consisting of a metal foil pattern of the TCP 4 with a relatively long strength. Also, bending operation is performed to the metal wire pin lead 8 which is relatively strong, thus preventing the reliability in the conduction function from being reduced. Further, a specific number of leads are formed in one piece to achieve a lead frame type manufacture.
申请公布号 JPH06318616(A) 申请公布日期 1994.11.15
申请号 JP19930105261 申请日期 1993.05.06
申请人 HITACHI LTD;HITACHI DEVICE ENG CO LTD 发明人 OTAKA TAKASHI;ASO MASARU;TAKACHIO AKIHIRO
分类号 H01L21/60;H01L23/50;H05K3/30;H05K3/34;(IPC1-7):H01L21/60 主分类号 H01L21/60
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