发明名称 Delay line device and method of manufacturing the same
摘要 A delay line device comprises first and second substrates. The first substrate has a signal line centrally formed on one of main surfaces of a ceramic substrate, bonding electrodes formed in a peripheral portion of the main surface and a ground electrode formed over substantially the entire region of the other main surface thereof. The second substrate has bonding electrodes formed on one of main surfaces of a ceramic substrate identical in thickness and material to the above ceramic substrate and a ground electrode formed over substantially the entire region of the other main surface thereof. The delay line device is formed by superimposing the first and second substrates on one another so that the bonding electrodes of the first substrate face those of the second substrate and bonding the bonding electrodes of both substrates to one another. Such delay line devices can be manufactured using mother substrates and mother dummy substrates.
申请公布号 US5365203(A) 申请公布日期 1994.11.15
申请号 US19930140539 申请日期 1993.10.25
申请人 SUSUMU CO., LTD. 发明人 NAKAMURA, NAKABA;KOSAKI, MAKOTO
分类号 H01F17/00;H01F41/04;H01P3/08;H01P9/00;H01P11/00;H03H7/34;H05K1/02;H05K1/03;H05K1/14;H05K3/32;H05K3/34;H05K3/36;H05K3/46;(IPC1-7):H01P9/00;H01P1/18 主分类号 H01F17/00
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