| 摘要 |
In bubble jet heater dies, a photolithographic process is disclosed to form patterned photoresist structures having re-entrant angles to facilitate an improved lift-off structure for anti-cavitation layer deposition. A substrate is coated with a photoresist which includes 0.5% to 1.0% Monazoline C. When exposed to Ultra-Violet light and developed, apertures in the photoresist have inverted side walls. Anti-cavitation material, such as tantalum, is then sputtered onto the substrate and the photoresist to form patterned metal. structures. The lift-off of the patterned photoresist is easily performed leaving behind the patterned metal structures. The use of this lift-off deposition method prevents stress-cracking in the anti-cavitation layer seen in deposition and etch methods.
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