| 摘要 |
PURPOSE:To reduce the size of a substrate processor by providing a hand for temporarily holding a processed substrate on a stage, supplying unprocessed substrate onto the stage by a single supplying and recovering hand, and recovering the processed substrate. CONSTITUTION:A wafer W1 is removed from a wafer carrier, and placed by a hand HA on a chuck WC. Then, an XY stage is moved, and the hand HC is rotated 180 deg. in parallel with the exposing operation of the wafer W1. Thereafter, the stage is moved to a delivering position side, and the wafer W1 is removed by the hand HC on the chuck WC on the way. Unexposed wafer W2 is brought from the hand HA onto the chuck WC, the the hand HC is simultaneously rotated 180 deg., and the exposed wafer is handed to the hand HA side. |
