PROCEDE DE MONTAGE D'UN CIRCUIT INTEGRE SUR UN SUPPORT MINCE.

摘要

A manufacturing method for a thin semiconductor device assembly includes forming an internal frame for positioning an IC module within an external frame that forms the periphery of the thin semiconductor device assembly, positioning the IC module in the internal frame so that an electrode terminal surface of the IC module is exposed, and fixing the IC module in place by filling the external and internal frames with resin.