发明名称 High ortho-ortho bonded novolak binder resins and their use in radiation-sensitive compositions.
摘要 <p>A phenolic novolak composition prepared by a process characterized by the steps of: (1) reacting a first phenolic monomer comprising a major portion of at least one trifunctional phenolic monomer with a first aldehyde source in the absence of a catalyst at a reaction temperature from about 100 DEG C to about 200 DEG C and at a reaction pressure of about 2 to about 15 atmospheres to form a phenolic oligomer having a weight average molecular weight from about 500 to about 2,000, having ortho-ortho bonding of about 55% to about 75% of the methylene bonds between the phenolic moieties; and having a time to clear of less than 125 seconds per micron; wherein the mole ratio of said first aldehyde source to said first phenolic monomer is from about 0.3:1.0 to about 0.55:1.0; and (2) then reacting said oligomer with an optional second phenolic source and a second aldehyde source at a temperature from about 80 DEG C to about 150 DEG C to form a phenolic novolak having a weight average molecular weight of 3,000 to 40,000, having ortho-ortho bonding of between 50% and 70% of the methylene bonds between the phenolic moieties, and having a time to clear of at least 20 seconds per micron; wherein the mole ratio of said second aldehyde source to said total phenolic moieties is less than about 0.8:1.0.</p>
申请公布号 EP0623633(A2) 申请公布日期 1994.11.09
申请号 EP19940303288 申请日期 1994.05.06
申请人 OCG MICROELECTRONIC MATERIALS, INC. 发明人 SIZENSKY, JOSEPH J.;SARUBBI, THOMAS R.;TOUKHY, MEDHAT A.
分类号 C08G8/04;C08G8/10;C08G8/00;C08L61/04;C08L61/06;G03F7/023;(IPC1-7):C08G8/04;G03F7/022 主分类号 C08G8/04
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