发明名称 |
High ortho-ortho bonded novolak binder resins and their use in radiation-sensitive compositions. |
摘要 |
<p>A phenolic novolak composition prepared by a process characterized by the steps of: (1) reacting a first phenolic monomer comprising a major portion of at least one trifunctional phenolic monomer with a first aldehyde source in the absence of a catalyst at a reaction temperature from about 100 DEG C to about 200 DEG C and at a reaction pressure of about 2 to about 15 atmospheres to form a phenolic oligomer having a weight average molecular weight from about 500 to about 2,000, having ortho-ortho bonding of about 55% to about 75% of the methylene bonds between the phenolic moieties; and having a time to clear of less than 125 seconds per micron; wherein the mole ratio of said first aldehyde source to said first phenolic monomer is from about 0.3:1.0 to about 0.55:1.0; and (2) then reacting said oligomer with an optional second phenolic source and a second aldehyde source at a temperature from about 80 DEG C to about 150 DEG C to form a phenolic novolak having a weight average molecular weight of 3,000 to 40,000, having ortho-ortho bonding of between 50% and 70% of the methylene bonds between the phenolic moieties, and having a time to clear of at least 20 seconds per micron; wherein the mole ratio of said second aldehyde source to said total phenolic moieties is less than about 0.8:1.0.</p> |
申请公布号 |
EP0623633(A2) |
申请公布日期 |
1994.11.09 |
申请号 |
EP19940303288 |
申请日期 |
1994.05.06 |
申请人 |
OCG MICROELECTRONIC MATERIALS, INC. |
发明人 |
SIZENSKY, JOSEPH J.;SARUBBI, THOMAS R.;TOUKHY, MEDHAT A. |
分类号 |
C08G8/04;C08G8/10;C08G8/00;C08L61/04;C08L61/06;G03F7/023;(IPC1-7):C08G8/04;G03F7/022 |
主分类号 |
C08G8/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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