| 摘要 |
An apparatus for producing a plurality of resin molded semiconductor devices by an injection molding process wherein molten resin is injected into a plurality of die cavities on a lower die half while a plurality of semiconductor devices are placed in the die cavities. Each of the semiconductor devices is constructed such that different kinds of semiconductor elements (19a, 19b, 19c) are mounted on beds (13a, 13b, 13c) each having different dimensions in a lead frame (10) and electrodes on each semiconductor element (19a, 19b, 19c) are connected to inner leads (12a) in the lead frame (10) via a plurality of fine metallic wires. An injection gate (22) for each die cavity is located at the position in the vicinity of the bed (13a, 13b) having a larger area among a plurality of beds (13a, 13b, 13c) each having different dimensions. The injection gate (22) may be located at a position in the vicinity of the bed (13a) having a largest area among the beds (13a, 13b, 13c; in the lead frame (10). Alternatively, the injection gate (22) may be located at an intermediate location between a pair of beds (13a) each having a larger area among the plural beds (13a, 13b, 13c) in the lead frame (10). |
