Power supply structure for multichip package.

摘要

A power supply structure for a multichip package is provided to improve the transmission performance of signals. Cases (120) are fitted onto one face of a ceramic substrate (103). On the other face are aligned substrates (121). On each of the substrates (121) are erected I/O pins (105). The I/O pins (105) are connected to signal pins (113) of LSIs (101) via the ceramic substrate's internal layer (104). On side faces of the substrates (121) are pvovided power supply pads (122). To the power supply pads (122) are connected the power supply pins (112) of the LSIs (101) via the ceramic substrate's internal layer (104). When power is to be supplied, electroconductive bars (123) are inserted between the substrates (121). The electroconductive bars (123) supply power to the LSIs (101) via the power supply pads (121). A cable (110) is connected to one of the I/O pins (105).