THREE-DIMENSIONAL PACKAGE FOR HIGH PERFORMANCE COMPUTER AND STRUCTURE THEREOF

摘要

PURPOSE: To provide a three-dimensional structure for a high-performance computer and its manufacturing method. CONSTITUTION: There is provided with a high-density packaging of a large number of integrated circuit chips for the minimum communication distance and the maximum clock speed of a computer. A packaging structure is formed by a plurality of subassemblies 6 and 7. The subassemblies 6 and 7 are formed by a substrate 8 with at least one integrated circuit device on at least one surface. A second substrate 18 is provided between adjacent subassemblies. Electrical interconnection means 29 and 32' for electrically interconnecting contact parts 28 and 37' on the subassemblies 6 and 8 to contact parts 32 and 36 on the second substrate 18 exist. The electrical interconnection means is, for example, solder mound and wire bond.