发明名称 Method of forming double well substrate plate trench DRAM cell array
摘要 A high density substrate plate DRAM cell memory device and process are described in which a buried well region is formed adjacent to deep trench capacitors such that the substrate region of DRAM transfer FETs can be electrically isolated from other FETs on a semiconductor substrate. The buried region is partially formed by ion implantation and diffusion to intersect the walls of the deep trenches.
申请公布号 US5362663(A) 申请公布日期 1994.11.08
申请号 US19930072261 申请日期 1993.06.04
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BRONNER, GARY B.;DHONG, SANG H.;HWANG, WEI
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/10;H01L27/108;(IPC1-7):H01L21/70;H01L27/00 主分类号 H01L27/04
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