| 摘要 |
<p>PURPOSE:To accurately and completely mount and fix a semiconductor chip on a bonding position, to flatten the protuberance of a preform material, and to prevent the sucking of the preform material. CONSTITUTION:A recessed part 4 with which a semiconductor chip is grasped, an air-feeding part 2 with which the semiconductor chip, held to the recessed part 4, is vacuum. sucked, and a collet 1 are provided. An exhaust hole 3 which communicate wich a gap formed between the side of the semiconductor chip and the collet 1 is provided. An inert gas exhaust means 5, with which inert gas is jetted out toward preform material, is connected to the exhaust hole 3.</p> |
