发明名称 Thermoelectric conversion module with series connection
摘要 In the conventional thermoelectric conversion module, P-type thermoelectric semiconductor chips and N-type thermoelectric semiconductor chips are alternately arranged in both the longitudinal and the transverse directions. Consequently, assembling work is complicated and there arises the problem in quality that erroneous types of chips are arranged. In the present invention, therefore, each of either rows of chips or columns of chips is constituted by thermoelectric semiconductor chips of the same type, thereby to improve assembling workability as well as to prevent erroneous arrangement. Furthermore, as a preferred fabricating method, bar-shaped thermoelectric semiconductors are used and are jointed to one substrate and then, are electrically disconnected between the leads.
申请公布号 US5362983(A) 申请公布日期 1994.11.08
申请号 US19940191066 申请日期 1994.02.03
申请人 YAMAMURA, AKIRA;BALDWIN, JOHN 发明人 YAMAMURA, AKIRA;BALDWIN, JOHN
分类号 H01L35/32;(IPC1-7):H01L29/66 主分类号 H01L35/32
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