| 摘要 |
PURPOSE:To realize a hybrid integrated circuit device wherein a resin cover can be mounted on a heat sink without using bonding agent by a method wherein a fitting means is provided to both the resin cover and the heat sink to fit them together. CONSTITUTION:In a hybrid integrated circuit, only when a resin cover 13 is pressed against a heat sink 12, the resin cover 13 is fixed to the heat sink 12 with a pawl 13a and a recess 12a without using bonding agent. On the contrary, a recess 13b is provided to the resin cover 13, and a pawl-shaped projection 12b is provided to the heat sink 12 corresponding to the recess 13b provided to the resin cover 13, and the resin cover 13 and the heat sink 12 are fixed together with the recess 13b and the pawl-shaped projection 12b. Therefore, a fitting part is provided to both a resin cover and a heat sink, and the resin cover can be mounted o the heat sink without bonding agent only by pressing the board against the heat sink from above, so that a hybrid integrated circuit device can be simplified in assembling operation. |
