| 摘要 |
<p>PURPOSE:To make it possible to peel off an IC chip from a dicing tape in a reliable and stable manner, and also to improve quality, yield of production and efficiency of device without expanding a dicing tape and without damaging the dicing tape and IC chip. CONSTITUTION:The IC chip on a dicing table 2 is pushed up by the needle 4 arranged in a freely advancing or retreating manner in the pepper pot 7 which is pressed to the rear surface of the dicing table, and the IC chip 1 is picked up by the collet from the upper part of the needle 4. The pepper pot is formed into a conical trapezoid shape having the tip face 7a narrower than the bottom face of the IC chip, it is arranged in a vertically moving state, and the IC chip on the dicing table is pushed up by the pepper pot.</p> |
