| 发明名称 |
Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof |
| 摘要 |
A bonded ceramic-metal composite substrate comprising a ceramic substrate having opposite surfaces and a copper sheet having a face directly bonded to one of the surfaces of the ceramic substrate, characterized in that the Vickers hardness of the copper sheet lies in the range from 40 kg/mm2 to 100 kg/mm2.
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| 申请公布号 |
US5363278(A) |
申请公布日期 |
1994.11.08 |
| 申请号 |
US19920889384 |
申请日期 |
1992.05.28 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KOMORITA, HIROSHI;MIZUNOYA, NOBUYUKI |
| 分类号 |
C04B41/88;C22C9/00;H01L21/48;H01L23/12;H01L23/498;H05K1/03;H05K1/09;H05K3/38;(IPC1-7):H05K1/18;H05K7/02 |
主分类号 |
C04B41/88 |
| 代理机构 |
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代理人 |
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