发明名称 |
Method of making an electronic assembly having a flexible circuit wrapped around a substrate |
摘要 |
An electronic package assembly that includes a flexible circuit wrapped around a metal substrate. The leads of the flexible circuit are connected to an integrated circuit that is mounted to the top surface of the substrate. The flexible circuit has a plurality of metal pads located adjacent to the bottom surface of the substrate. The flexible circuit also contains a power/ground plane and a number of conductive signal lines that couple the integrated circuit to the metal pads. The pads can be soldered to a printed circuit board to electrically couple the integrated circuit to the board.
|
申请公布号 |
US5362656(A) |
申请公布日期 |
1994.11.08 |
申请号 |
US19940228095 |
申请日期 |
1994.04.15 |
申请人 |
INTEL CORPORATION |
发明人 |
MCMAHON, JOHN F. |
分类号 |
H01L23/495;(IPC1-7):H01L21/56;H01L21/60 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|